Bostik to Launch Flexible Packaging Adhesive Innovations at PACK EXPO International
Bostik, a leading global adhesive specialist for industrial, construction and consumer markets, has announced it will exhibit and launch three new flexible packaging adhesive innovations at PACK EXPO on November 6-9 in Chicago, IL.
Co-located with PHARMA Expo, PACK EXPO is the largest processing and packaging trade show in the world. It features over 2,400 exhibitors and draws upwards of 50,000 attendees. Located in the West Building of McCormick Place this year, PACK EXPO also offers a range of complimentary educational sessions.
At the show, Bostik will launch its new hot melt lidding adhesive product, ThermogripÒ H1955. Designed for lidding and individual container applications, this adhesive offers several benefits. With a low heat seal temperature starting at 160°F, H1955 provides excellent and consistent peel force at elevated temperatures. These features allow end users to run faster line speeds, increasing production efficiency and preventing burn-through. As a result, customers are able to use more cost effective or thin gauge materials, which provide cost savings. H1955 also offers excellent blocking resistance, good thermal stability and superior adhesion to various films including polypropylene, polyethylene and polyethylene terephthalate.
Bostik will also launch its new resealable adhesive products, JB018 and JB020, at PACK EXPO. These are ideal for niche markets such as multi-serve packaging for food items or consumer goods. Examples include dry foods, such as salty or sweet snacks and confectionery goods, disposable razors and cartridges, electric toothbrush attachments and other portioned packages. These acrylic, water-based pressure sensitive adhesives have broad FDA-clearance and are approved for direct food contact. They are environmentally friendly with low VOC compounds in their formulations. JB018 and JB020 also offer good machinability, streamlining manufacturing processes and saving customers time and money as a result. Furthermore, JB018 and JB020 have reseal strengths that range from 100 – 150 grams per inch, depending on the substrate. With an ability to be used in removable applications, both resealable adhesives feature a smooth magnetic peel, which appeals to end-use customers. While these products offer similar performance properties, JB018 offers slightly less tack than JB020, making it ideal for applications that require less reseal strength.
To attend PACK EXPO, visit www.packexpointernational.com, and stop by Bostik’s booth #E10707 to learn more about the company’s three new products.
About Bostik, an Arkema company
Bostik is a leading global adhesive specialist in industrial, construction and consumer markets. For more than a century, it has been developing innovative adhesive solutions that are smarter and more adaptive to the forces that shape daily lives. From cradle to grave, from home to office, Bostik’s smart adhesives can be found everywhere. With annual sales of €1.6 billion, the company employs 4,800 people and has a presence in more than 50 countries. For the latest information, visit www.bostik.com/us.
A designer of materials and innovative solutions, Arkema shapes materials and creates new uses that accelerate customer performance. Our balanced business portfolio spans high-performance materials, industrial specialties and coating solutions. Our globally recognized brands are ranked among the leaders in the markets we serve. Reporting annual sales of €7.7 billion in 2015, we employ approximately 19,000 people worldwide and operate in close to 50 countries. We are committed to active engagement with all our stakeholders. Our research centers in North America, France and Asia concentrate on advances in bio-based products, new energies, water management, electronic solutions, lightweight materials and design, home efficiency and insulation. For the latest, visit www.arkema.com.